Our Mission: Total Customer Satisfaction

Our business strategy is to concentrate on the niche market which has become our core competence, as such we have experiences on the following:

- Recycling of Shipping and Test Trays for leading international semiconductor companies through ultrasonic cleaning machine, inclusive of testing and outgoing inspection. We are capable of anti-static chemical redipping of plastic trays and tubes using locally ASET formulated antistatic chemical agent, all done under controlled cleanroom Class 10K conditions.

- Erase and Remarking of semiconductor devices.

- High speed pick and plate of dice from sawn wafer and 2nd optical inspection using military standards.

- Ceramic substrate inspection using low and high power microscopes.

Full Semicon Assembly Gold/Aluminum wire Discreet devices such as crystal oscillators, metal cans, substrates

Partial Processes Erase/Remark Ink and Laser Sequential Test Process using conveyorized ovens Special manual assembly/wirebond and Die Attach Second optical inspection and final visual inspection (dice/BGA's/leadframe inspection) Leadframe cutting and downsetting