Facility and Equipment

FACILITY

Present total area is 5,650 square feet  where 4,900 square feet devoted to production operations and 750 square feet for administration office.

EQUIPMENT The company has a complete assembly line capability for TO-92 packages, TO-39 and other metal can devices, from die attach (both eutectic an epoxy) through test with the finished units ready for drop-shipment to customer’s designated end users.

The company also has the capability for the assembly of hybrid components such as oscillators, substrates, etc. Additionally, the company is currently a major supplier of recycled trays, both process and carrier trays, for multinational semiconductor assemblers in the Philippines.

Centrotherm Conveyorized process Controlled Reflow Oven
Maximum set temp 1000ºC/zone / 4 zones plus peak zone
HEBB Conveyorized Radiation Reflow Oven – 4 zones 240ºC 15cm/min
IR Reflow Oven
Blue M Oven
Nikon High Powered Microscope
BAUSCH & Lomb Low Powered Microscope
Granite Inspection Plates
Clean Room available Class 10,000
ESEC 2003 Die Attach
K&S 1419 Auto Wire Bonders - Gold
K&S 1470, Auto Wire Bonders – Aluminum
K&S 1482, Auto Wire Bonders – Gold
K&S 484, Manual Wire Bonders – Aluminum
K&S 479, Manual Wire Bonders – Gold
TO-92 – 800 Cav. KRAS Molds
TO-92 – 600 Cav. KRAS Molds 3L Sensors
TO-92 – 400 Cav. KRAS Molds
195 Tons Hydraulic Mold Press
15 Tons Hydraulic Trim & Form Press
5 Tons Pneumatic Singulation Press
Solder Dip System
Teradyne T347 Testers with Multiplexer
Tesec 786 Test Handlers
Markem 1187 Marking Machines