
Nanocoating & Nanoclear® Stencil Treatment
WINNER 2014 Circuits Assembly New Product Introduction Award & WINNER 2014 Global Technology Awards
Proven technology in PCB assembly for over 5 years
NanoClear wipes:
- Modify stencil contact surfaces with a flux repellent nanocoating in minutes
- Increase yields and output on SMT assembly lines
- Improve print quality and reduce variation
- Decrease understencil wipe frequency
- Utilize proprietary SAMP technology
- Surpass competitive coatings in cost, performance and ease of us
Overview of Print Quality Improvements
Higher Print Yields

Better Volume Repeatability

Reduce Under Wipe Frequency

1: “Fine Tuning The Stencil, Manufacturing Process and Other Stencil Printing Experiments”, Shea, C. and Whittier, R., Proceedings of SMTA International, October 2013l
Nanocoating & Nanoclear® Summary
- Increases print yields
- Reduces print volume variation
- Improves print definition
- Extends under wipe frequency
- Extensively tested & broadly adopted
- Decreases wipe consumables costs & downtime
- Delivers the industry’s best cost, performance and ease of use
Nanoproof™ PCB Waterproofing Summary:
- Liquid At Room Temperature
- Ability To Protect Many Substrates On A PCB
- Post Treatment Water Contact Angle From 100°-120°
- Post Treatment Oil Contact Angle Up To 76°
- Push Through Connectivity On Some Products
- Dry Time From 5-60 Minutes At Room Temperature
- No Cure Required & UV Tracer